SEOUL – October 31, 2026 -- NIDS Co., Ltd., a South Korean environmental sensor maker that says it has supplied more than 10 million sensors cumulatively, has confirmed it will exhibit at CES 2027 to convert product introductions into overseas supply contracts.

The company is targeting global home appliance makers, HVAC specialists and robotics companies. Its customer base already includes Dyson, Samsung Electronics and Hyundai Motor.

London – October 19, 2026 -- The global 3D through-silicon-via (TSV) and 2.5D packaging market will grow from USD 9.46 billion in 2025 to USD 21.50 billion by 2035, according to Credence Research. That implies a compound annual growth rate of 8.50% for 2026-2035. The figures are the firm's proprietary model estimates, not audited supplier sales totals.

Shenzhen – October 18, 2026 -- More than half of cloud data center capital expenditure is expected to go to memory and storage, excluding HBM, by 2027, according to a projection by Morgan Stanley's Daniel Yen presented at the 5th GMIF Innovation Summit. The forum, themed "The Future Built on AI Memory and Storage," was co-hosted by the Shenzhen Memory Industry Association (SMIA) and Peking University's School of Integrated Circuits at the Renaissance Shenzhen Bay Hotel.

New York – October 07, 2026 -- Samsung Wallet and Samsung Pay will support stablecoin transfers on Solana, letting U.S. Galaxy users send cross-border payments in USDC starting the last week of October 2026, the Solana Foundation announced.

Pune, India – October 06, 2026 -- The global smart refrigerator market will climb from USD 5.28 billion in 2025 to USD 14.30 billion by 2034, expanding at a compound annual growth rate of 11.7% between 2026 and 2034, according to a new analysis by Maximize Market Research.

Shenzhen – September 27, 2026 -- Memory and storage executives from Samsung, Sandisk, Solidigm, Arm and Lenovo converged in Shenzhen on September 23 to argue that AI inference workloads, not training alone, are now the primary driver reshaping storage architecture demand. The 5th GMIF2026 Innovation Summit, co-hosted by the Shenzhen Memory Industry Association (SMIA) and Peking University's School of Integrated Circuits, drew IDMs, controller makers, OSATs, and AI infrastructure vendors under the theme "The Future Built on AI Memory and Storage."