Infineon opens new backend manufacturing hub in Thailand adding resilient capacity for future growth

- New backend manufacturing hub strengthens and further diversifies Infineon's global production network

- Strategic investment reinforces Thailand's growing semiconductor ecosystem and talent development, creating up to 1,000 highly skilled jobs

- Designed for phased expansion, Bangkok has the potential to become one of Infineon's largest backend manufacturing sites over time

BANGKOK, Oct. 1, 2026 /PRNewswire/ -- Infineon Technologies AG (FSE: IFX) (OTCQX: IFNNY) officially inaugurated its new backend manufacturing site in Bangkok, Samut Prakan, together with Anutin Charnvirakul, Prime Minister of Thailand and Alexander Gorski, Chief Operations Officer of Infineon Technologies. The site strengthens and further diversifies the company's global manufacturing footprint while adding capacity for future growth. Strategically located in the heart of Southeast Asia, the site reinforces Infineon's ability to serve customers worldwide at a time when long-term semiconductor demand continues to grow, driven by digitalization, electrification and the energy transition.

Built for future growth, the facility can scale up to five modules, giving Bangkok the potential to become one of Infineon's largest backend manufacturing sites over time. As a strategic addition to Infineon's globally diversified manufacturing network, the site complements the ongoing expansion of Infineon's frontend manufacturing capacities.

"What makes Bangkok such an important addition to our global manufacturing footprint is its unique combination of location and growth potential," says Alexander Gorski, Chief Operations Officer of Infineon Technologies. "We are establishing a new hub in the heart of Southeast Asia, surrounded by a fast-growing ecosystem and with excellent access to global logistics. This helps us further diversify our manufacturing network across regions and serve our customers with resilient capacity and great flexibility. We have built the Bangkok site with the future in mind. Starting with Module A, the site can grow to up to five modules over time, giving us unique scalability to support future growth."

"Infineon's new backend manufacturing site in Bangkok, Samut Prakan, is a strong vote of confidence in Thailand's future as a leading semiconductor location," says Anutin Charnvirakul, Prime Minister of Thailand. "Together, we are advancing Thailand's semiconductor ecosystem, strengthening our role in the global value chain and creating new opportunities and highly skilled jobs for future generations. We welcome Infineon's long-term engagement and look forward to deepening our cooperation."

A long-term investment in Thailand's semiconductor ecosystem

Thailand's commitment to building a strong semiconductor ecosystem, guided by its national technology strategy, is creating new momentum for advanced manufacturing and technology-driven growth in the region. Thailand offers excellent connections throughout Southeast Asia, proximity to key customer markets and a long-standing semiconductor manufacturing heritage. The Bangkok site builds on local expertise, established partnerships and a highly skilled workforce while contributing to the further development of Thailand's flourishing semiconductor ecosystem.

The site currently employs around 350 people and is expected to grow to approximately 1,000 employees as the first building (Module A) ramps up. Beyond manufacturing, Infineon supports talent development through collaborations with universities, educational institutions and industry partners.

Expanding capabilities for complex, high-value semiconductor solutions

The Bangkok site combines advanced automation, scalable design and a digital manufacturing backbone to support efficient, stable and high-quality production at scale. Built as a greenfield site, the facility leverages proven expertise from Infineon's established backend manufacturing locations while providing the flexibility to adapt to evolving customer requirements, new technologies and large production volumes.

Equipped with advanced cleanroom, assembly and test capabilities, all supported by a high level of automation, the Bangkok site covers the full spectrum of semiconductor backend processes as well as wafer test. This unique combination strengthens its role within Infineon's manufacturing network and enables increasingly complex, high-value semiconductor solutions for applications across the automotive, industrial and energy infrastructure, contributing directly to technologies that drive electrification, energy efficiency and digitalization worldwide.

Sustainability built in from the ground up

The Bangkok site runs on 100 percent green electricity, incorporates water recycling and rainwater collection systems and is equipped with solar modules that generate renewable energy on site. Together, these measures support resource-efficient manufacturing and contribute to Infineon's strategic priority of continuously reducing its carbon footprint across the entire value chain.

For more information about the new backend manufacturing site in Bangkok, please visit: 

https://www.infineon.com/careers/our-locations/thailand#highlights 

For press pictures, please visit:

https://brandportal.infineon.com/file-exchange/list/287a46dc81f8ee3793598fc9d8001829

For footage, please visit:

https://brandportal.infineon.com/file-exchange/list/614a2724ddb32ff277721f8e913fcf9f 

About the Thailand Board of Investment (BOI)

The Thailand Board of Investment (BOI) is a government agency under the Office of the Prime Minister. Its mission is to foster valuable investment in Thailand through promotion packages, facilitation services and the integration and connection of businesses.

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

Media contact:

Franziska Hofmeister

Head of Operations Communications

+49 89 234 2216

[email protected]

SOURCE Infineon Technologies AG

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Vieworks to Showcase High-Speed Machine Vision Technologies at VISION 2026

ANYANG, South Korea, Oct. 1, 2026 /PRNewswire/ -- Vieworks, a global provider of industrial imaging solutions, will participate in VISION 2026, the world's leading trade fair for machine vision held in Stuttgart, Germany, from October 6 to 8. At Hall 10, booth 10E30, Vieworks will demonstrate a diverse portfolio of high-speed, high-resolution industrial cameras, showcasing its expertise in advanced imaging technologies.

The exhibition will feature Vieworks' extensive range of area scan cameras, covering resolutions from 0.4 megapixels to 1152 megapixels. The VZ Series, available with GigE, 2.5GigE, and USB 3.0 interfaces, offers compact and versatile imaging options for automated inspection and other machine vision applications across various industries. Vieworks will also present its VL Series of line scan cameras, featuring 5GigE and 10GigE interfaces and resolutions ranging from 2k to 16k.

Vieworks will also showcase its VT Sense Series, a lineup of BSI (back-side illuminated) TDI (time delayed integration) line scan cameras. Supporting up to 384 stages of integration, the cameras deliver outstanding sensitivity for applications where reliable imaging in low-light conditions is essential. The BSI sensor technology provides excellent quantum efficiency (QE) and a strong signal-to-noise ratio (SNR), enabling high-quality imaging across the visible, UV (ultraviolet), and NIR (near-infrared) spectral ranges.

Another highlight of Vieworks' exhibition will be CoaXPress-over-Fiber, a next-generation high-speed interface technology. Vieworks will demonstrate a complete CoaXPress-over-Fiber solution, incorporating the camera, fiber-optic cable, transceivers, and frame grabber as an integrated setup. The setup supports data transmission speeds of up to 100 Gbps per channel and transmission distances of up to 10 km. By providing the complete solution from a single source, Vieworks enables a streamlined approach to high-speed machine vision system configuration.

"VISION is an important opportunity for us to connect with customers and partners from around the world and share our latest imaging technologies," said a Vieworks spokesperson. "At VISION 2026, we look forward to demonstrating how our machine vision solutions can address the evolving requirements of demanding applications and further strengthen our role as a trusted vision partner."

VISION 2026 will be held at Messe Stuttgart, bringing together leading companies and professionals from across the global machine vision industry.

About Vieworks Co., Ltd.

Vieworks is a global provider of machine vision solutions, offering a comprehensive portfolio of industrial cameras, industrial lenses, and machine vision accessories. With advanced imaging technologies and a commitment to innovation, Vieworks supports customers in developing reliable and high-performance vision systems. For more information, please visit vision.vieworks.com.

SOURCE Vieworks Co., Ltd.

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Cervoz Launches MIL-STD-810H M.2 NVMe SSDs for Mission-Critical Embedded Systems

T449 and T459 Series deliver PCIe Gen4 performance, hardware-based data security, and rugged reliability for defense, aerospace, and industrial applications

TAIPEI, Oct. 1, 2026 /PRNewswire/ -- Cervoz Technology, a leading provider of industrial storage, memory, and expansion module solutions, announced the launch of its T449 and T459 Series, a new line of MIL-STD-810H compliant M.2 2280 NVMe SSDs engineered for embedded systems deployed in defense, aerospace, transportation, and industrial automation.

Environmental Reliability

Harsh environments place continuous mechanical and environmental stress on embedded storage. The T449 and T459 Series comply with MIL-STD-810H requirements for vibration, shock, and combined temperature-altitude testing to support reliable operation in demanding deployments.

Anti-Vibration Fill is integrated as a standard design feature to mechanically secure the controller and NAND chips against prolonged vibration. For deployments in high-humidity or harsh outdoor environments, optional Conformal Coating provides a specialized moisture and chemical barrier, isolating sensitive circuitry from airborne contaminants.

Sustained Performance

Applications such as mission computers, AI edge platforms, video recording, and industrial data logging require storage capable of maintaining stable write performance during continuous operation.

Supporting PCIe Gen4 x4 NVMe, the T449 and T459 Series deliver up to 5,085 MB/s read and 4,765 MB/s write. Industrial 3D TLC NAND, LDPC error correction, wear leveling, and End-to-End Data Protection help maintain data integrity during sustained workloads.

Hardware-Based Data Protection & Destruction

In highly secure operations, protecting sensitive information goes far beyond standard software encryption. During equipment maintenance, redeployment, or in the event of hardware compromise, storage devices require immediate, foolproof, and irreversible sanitization methods that comply with strict security protocols.

The T449 and T459 Series integrate Multi-Layered Data Security, managed at the hardware level, to address these critical security requirements:

- Write Protection: A hardware-enforced lock that prevents unauthorized modification or tampering of critical boot files and data.

- Quick Erase: Removes all stored data within seconds, preparing the SSD for redeployment or reuse.

- Physical Destroy: The ultimate hardware-based safeguard. Via a dedicated hardware trigger, the SSD initiates high-voltage physical destruction, routing electrical overstress to burn out the NAND Flash controller and memory cells. This physically disables the silicon, ensuring sensitive data is permanently and irreversibly unrecoverable even if the physical drive is compromised or lost.

Extended Endurance

Long-term storage reliability depends on efficient flash management as much as NAND quality. The T459 Series further integrates Over-Provisioning, Dynamic SLC Write Cache, Safeguard, and Circuitguard technologies to reduce write amplification, improve flash endurance, and maintain consistent performance during continuous recording and other write-intensive applications.

Target Applications

Typical deployment platforms include:

- Defense and rugged embedded computers

- Ground vehicle, marine, and aerospace support systems

- Unmanned platforms (UAV, UGV, and USV)

- Transportation and industrial automation systems

The Cervoz T449 and T459 Series are available in capacities up to 2TB, with both standard (0°C to 70°C) and wide (-40°C to +85°C) temperature options.

Contact the Cervoz team to learn more about the new MIL-STD-810H compliant SSD family.

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DUBLIN, Oct. 1, 2026 /PRNewswire/ -- Ensera, a global CDMO specializing in commercialization support for injectable drug programs, has launched the Ensera Alliance Network, bringing together leading device platform and fill-finish specialists to address the complexity of commercializing drug-device combination products.

The network currently includes injector platform providers SHL Medical, Stevanato Group and Ypsomed alongside fill-finish specialists Argonaut Manufacturing Services, and American Injectables.

Bringing a combination product to market often requires pharmaceutical companies to coordinate multiple specialist suppliers across device platforms, fill-finish, final assembly and packaging. Each handover can add complexity and slow progress, particularly when responsibilities, processes and timelines are not aligned.

The network is designed to create stronger connections between key stages of the combination product supply chain, helping pharmaceutical companies coordinate device platforms, fill-finish, final assembly and packaging, and accelerate programs towards commercial supply.

"Too many combination product programs are slowed by disconnected suppliers and difficult handovers," said Bobby O'Connor, Chief Commercial Officer at Ensera.

"The Ensera Alliance Network brings trusted specialists together around a more coordinated, responsive model, helping customers simplify commercialization, reduce risk and rapidly progress towards launch."

Darren Hieber, VP Alliance Partnerships at Ensera, said: "This network has been built on established relationships, shared experience and a practical understanding of how each organization operates.

By connecting partners across device platforms, fill-finish, final assembly and packaging, we can work more collaboratively around the needs of individual programs, identify challenges earlier and help customers navigate the transition towards commercial supply."

Ensera plans to expand the network over time, adding organizations whose capabilities, standards and approach complement those of existing members and the evolving needs of its customers.

Participation in the Ensera Alliance Network is non-exclusive. Ensera and the network participants remain independent organizations and customers may engage each company directly and separately.

About Ensera

Ensera is a global CDMO supporting pharmaceutical and medical device companies with device design, manufacturing, final assembly, labeling, and secondary packaging of injectable formats, including injectors and pre-filled syringes.

Its flexible GMP cleanroom operations across Europe, the US and Asia are optimized for low-to-medium batch volumes, supported by integrated quality systems and cold chain infrastructure. An approved assembly partner for market leading injector platforms, Ensera combines device and pharmaceutical expertise to deliver efficient, compliant supply for combination products.

For more information on the Ensera Alliance Network visit: www.ensera.com/ensera-alliance-network

Bold solutions. Brilliantly executed.

For additional information, visit www.ensera.com

Ensera Alliance Network members

SHL Medical - https://www.shl-medical.com/

Stevanato Group - https://www.stevanatogroup.com/

Ypsomed - https://www.ypsomed.com/

American Injectables - https://americaninj.com/

Argonaut Manufacturing Services - https://argonautms.com/ 

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FREIBURG, Germany, Oct. 1, 2026 /PRNewswire/ -- Hoymiles, a global provider of solar energy and storage solutions, supported the solar panel upcycling event in Freiburg, Germany, for the third consecutive year, providing 300 microinverters for 300 plug-in photovoltaic (PV) systems. More than 500 citizens along with local organizations and public representatives took part in the event, helping give 600 used solar panels a second life as plug-in solar systems for homes.

Giving solar panels a second life

Organized by German non-profit organization BalkonSolar e.V., the initiative demonstrates how solar equipment that remains functional after its first application can be reused in new settings.

During the event, participants assembled 300 plug-in PV systems, each consisting of two used PV modules, a microinverter, and the necessary cabling. The 600 panels had previously operated for 13 years on the roof of a toothbrush factory in the Black Forest. According to BalkonSolar e.V., around 5% of the panels showed defects, while the majority remained suitable for immediate further use. The completed systems were then provided to participating citizens free of charge, supported by funding from the City of Freiburg's Solar Summer program.

"Old solar panels do not have to be thrown away, but can be repurposed once they come down from a roof and easily and safely turned into plug-in PV systems", said Sebastian Müller, chair of the non profit BalkonSolar Association.

Three years of supporting solar upcycling

The Freiburg initiative marks Hoymiles' third consecutive year of supporting solar panel upcycling events in Germany. Since first joining the initiative in 2024, Hoymiles has continued to contribute microinverter technology to community-led projects.

"We are proud to support this initiative for the third consecutive year and to see more citizens take part in giving used solar panels a second life," said Hoymiles CEO Dr. Yang Bo. "Renewable energy is not only about generating clean power, but also about using resources responsibly."

From solar innovation to sustainable action

Hoymiles microinverters are well suited to upcycling applications because each module can operate independently with its own maximum power point tracking. This helps maintain system performance even when used modules have different conditions or orientations. By supplying the microinverters, Hoymiles provided the key component needed to convert previously used rooftop modules into complete, safe plug-in solar systems.

The initiative reflects Hoymiles' broader commitment to sustainability and its "Open Energy for All" vision, which aims to make smart solar energy more inclusive, practical and accessible.

The BalkonSolar Verein is a registered non-profit, full of passionate Plug-in-PV enthusiasts from the German-speaking region with roots in Freiburg with more than 300 members.

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Galaxy Agentic Operating System aims to connect physical infrastructure performance with valuation, underwriting, insurance, and investment decision-making

SOMERSET, N.J., Oct. 1, 2026 /PRNewswire/ -- Infrastructure AI is introducing Agentic Asset Valuation, a new capability of its vision to transform how buildings and physical infrastructure are understood, managed, financed, and valued through the Galaxy Agentic Operating System (GAOS), an agentic intelligence platform designed to convert real-time operational data into financial-grade intelligence.

For more than a century, commercial buildings and infrastructure assets have been valued largely through periodic assessments: appraisals, comparable transactions, historical financial performance, replacement-cost analysis, engineering reports, occupancy data, and projected cash flows. These methods remain foundational to real estate and infrastructure finance, but they generally provide a view of an asset at a particular point in time.

Every day, critical systems operate under changing conditions. HVAC equipment, pumps, elevators, electrical infrastructure, water systems, safety systems, and energy-management technologies generate operational data that can reveal equipment condition, efficiency, maintenance quality, reliability, risk exposure, and future capital needs. Despite the volume and potential value of that information, much of it remains fragmented across building-management systems, sensors, maintenance logs, equipment controllers, and specialized technical platforms.

Infrastructure AI believes the disconnect between operational data and financial decision-making is a significant opportunity for the convergence of artificial intelligence, physical infrastructure, and financial technology.

GAOS is being developed as an intelligence layer for physical infrastructure, enabling governed AI agents to interpret operational information across complex environments. Rather than simply automating predefined tasks, these agents assess relationships among equipment performance, maintenance history, energy use, operating patterns, reliability indicators, and broader asset condition.

The company's proposed capability, Agentic Asset Valuation, is designed to help create a continuously informed view of an infrastructure asset's operational and economic condition.

"Buildings are not static financial objects. They are living operating environments whose performance, maintenance, efficiency, resilience, and reliability materially affect their economics over time," said Dilip Rahulan, Co-Founder of Infrastructure AI. "Our objective is to enable infrastructure to generate the evidence needed to better understand its own condition—and to make that evidence useful, trusted, and actionable for the financial ecosystem."

Through Agentic Asset Valuation, GAOS is designed to analyze real-time and historical operational signals and translate them into decision-ready intelligence for asset owners, lenders, insurers, investors, public institutions, equipment manufacturers, and infrastructure operators. The platform is intended to complement—not replace—professional appraisal, engineering due diligence, underwriting, risk management, regulatory oversight, and fiduciary judgment.

The approach marks a shift from periodic valuation toward continuously informed valuation.

For example, recurring degradation in cooling equipment may be an engineering issue, but it may also signal higher future capital expenditure, increasing failure probability, potential tenant disruption, energy inefficiency, business-interruption exposure, and changing insurance or credit risk. Conversely, strong preventive maintenance, sustained energy-performance improvements, and high equipment reliability may provide evidence of effective asset stewardship and long-term value protection.

Infrastructure AI's proposed FinTech Engine is intended to make these relationships machine-readable and economically relevant. By translating operational evidence into governed financial signals, the platform could support a range of use cases, including underwriting, portfolio risk monitoring, insurance design, capital-planning analysis, asset financing, operational benchmarking, and investment decision support.

"Historically, operational data has been treated as technical exhaust—important to engineers and facility teams but rarely connected to the financial systems used to evaluate an asset," said Glen Allmendinger, Co-Founder of Infrastructure AI. "GAOS is designed to make that connection. The opportunity is not merely to collect more data; it is to give decisionmakers a persistent, evidence-based understanding of how physical performance influences risk, resilience, cost, and long-term asset value."

The company recognizes that broad adoption will require rigorous standards for data validation, cybersecurity, model governance, explainability, auditability, privacy, ownership, and regulatory acceptance. Infrastructure AI's approach is designed around governed agentic systems that can operate within defined institutional, technical, and compliance boundaries.

As buildings move from connected systems to intelligent and increasingly autonomous environments, Infrastructure AI believes the divide between operational technology, artificial intelligence, and financial technology will narrow. The company's long-term thesis is that infrastructure itself can become an active producer of financial intelligence—providing a continuously evolving view of the factors that influence risk, resilience, operating performance, and asset value.

Through GAOS, Agentic Asset Valuation, and the FinTech Engine, Infrastructure AI is pursuing a future in which the question is no longer only, "What was this building worth at its last appraisal?"

The more powerful question may become: "What is this building telling us it is worth—right now?"

About Infrastructure AI

Infrastructure AI is developing agentic intelligence systems for the world's physical infrastructure. Through the Galaxy Agentic Operating System, the company seeks to enable buildings, facilities, and infrastructure assets to generate governed, actionable intelligence from their operational environments. Its platform vision connects infrastructure operations with financial intelligence, risk management, sustainability, asset performance, and long-term value creation.

Learn more at https://www.infrastructureai.org

SOURCE Infrastructure AI

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New executive appointments further advance Teciem commitment to customer-centric innovation, cloud transformation and delivering AI-enabled solutions across treasury and capital markets

LONDON, Oct. 1, 2026 /PRNewswire/ -- Teciem, a global provider of front-to-back treasury and capital markets software solutions, today announced two key additions to its executive leadership team, appointing Stefano Maestri as Chief Technology Officer and Strath Lanyon as Chief Customer Officer. Both executives will be based in London and report directly to Teciem CEO Wissam Khoury.

The appointments represent another milestone in delivering the long-term strategy of Teciem, expanding the leadership team and reinforcing commitment to innovation, customer success and sustained investment in products, people and clients.

Demand for modern treasury and capital markets technology continues to grow as financial institutions seek faster deployment, greater operational efficiency and access to continuous innovation. Teciem is helping customers respond to these challenges through cloud-native solutions that simplify operations while supporting future growth.

Stefano's appointment strengthens the ability of Teciem to accelerate product innovation, cloud transformation and technology investment, while Strath's appointment enhances the company's focus on customer outcomes, adoption and long-term success.

The complementary expertise they bring will help Teciem continue delivering trusted, front-to-back treasury and capital markets solutions, deepening customer partnerships and supporting financial institutions through increasingly complex transformation programs.

Wissam Khoury, Chief Executive Officer and Board Director, Teciem, commented:

"Following the launch of Teciem just over six months ago, we are continuing to grow our leadership team and reshape the future of treasury and capital markets technology. Stefano and Strath bring exceptional experience in technology innovation, cloud transformation, customer success and operational excellence. Their appointments reflect our commitment to helping clients modernize faster, realize greater value from their technology investments, and benefit from the next generation of AI-enabled solutions. We are delighted to welcome them both to Teciem as we continue our strategic transformation and strengthen our position as the partner of choice for financial institutions worldwide."

As Chief Technology Officer, Stefano Maestri will lead global engineering and platform strategy at Teciem, helping shape the next generation of treasury and capital markets technology. He will focus on accelerating product innovation, advancing cloud and AI capabilities, and ensuring the resilience, security and scalability of all Teciem solutions. A proven technology leader with a strong track record across financial services and software businesses, Stefano brings deep expertise in mission-critical systems, platform transformation and global engineering leadership.

As Chief Customer Officer, Strath Lanyon will lead customer success at Teciem, deepening client partnerships, accelerating adoption, driving co-innovation and strengthening the team's ability to help customers modernize, realize value faster and achieve their strategic objectives. He brings more than 20 years of experience building and scaling IP- and services-led businesses across capital markets, RegTech and data automation.

About Teciem

Teciem is a global provider of front-to-back treasury and capital markets software solutions, serving banks and financial institutions of all sizes.

We deliver award-winning solutions for trading lifecycle and risk management, helping clients to operate seamlessly across asset classes and global markets. Built on decades of domain expertise, our solutions – Kondor, Summit, Opics, Sophis, Sophis Invest and Arc – are trusted by more than 340 financial institutions (and many of their subsidiaries) worldwide, including a majority of the top 100 global banks. For more information visit www.teciem.com

SOURCE Teciem

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Gentoo Media Inc. agrees EUR 50 million senior secured loan and secures full underwriting commitments for a planned EUR 50 million share issue to refinance its December 2026 bonds

REGULATORY NEWS•INSIDE INFORMATION•Nasdaq Stockholm: G2M

Gentoo Media Inc. - 1 October 2026, 08:00 CET

This information constitutes inside information that Gentoo Media Inc. (the "Company" or "Gentoo") is obliged to make public pursuant to the EU Market Abuse Regulation (Regulation (EU) No 596/2014, "MAR"). The information was submitted for publication at 08:00 CET on 1st October 2026.

BIRKIRKARA, Malta, Oct. 1, 2026 /PRNewswire/ --

- Gentoo Media PLC, a subsidiary of the Company, has agreed a EUR 50,000,000 senior secured term loan (the "Loan") with the Fundacja Zbigniewa Juroszka Fundacja Rodzinna ("ZJF"), a major shareholder of the Company (the "Lender").

- The Board of Directors of the Company (the "Board") plans to carry out a directed share issue of a new class of class of common stock targeting aggregate gross proceeds of EUR 50,000,000 (the "Share Issue"). The Share Issue is intended to be carried out during the fourth quarter of 2026, subject to further approvals, including the EGM approval of the increase in authorized share capital. Any decision to carry out the Share Issue and the final terms will be announced separately.

- The Company's largest shareholders, including MJ Foundation Fundacja Rodzinna ("MJF") and ZJF and Betplay Capital Fundacja Rodzinna (together, the "Backstop Providers") have signed commitments to fully underwrite any prospective Share Issue at a subscription price per share of SEK 6.1633, up to EUR 50,000,000.

- The Company has thereby secured commitments of in total EUR 100,000,000, an amount exceeding Gentoo Media P.L.C.'s outstanding ~EUR 91.5 million senior secured bonds 2023/2026 (the "Bonds").

- The combined net proceeds of the Loan and the Share Issue are intended to be applied to repay the Company's Bonds in full on the maturity date of 18 December 2026 and to further reduce the Company's debt facilities which currently stand at EUR 16,000,000 by ~EUR 8.5 million.

- The new capital structure returns control of the Group's cash flows to the Company: the Loan can be repaid at any time without penalty or premium, carries no equity component, and - once the Bonds are redeemed - gives the Board flexibility over time to consider returning capital to shareholders through dividends and share buybacks.

- To enable the Share Issue, the Board intends to convene an Extraordinary General Meeting ("EGM") to (i) increase the number of authorized shares of the Common Stock from 200,000,000 shares to 250,000,000 shares, and (ii) authorize an additional class of common stock, $0.001 par value per share, of the Company, to be designated "Class Z Common Stock," consisting of 100,000,000 shares, where the number of shares of Class Z Common Stock in issue will at no time exceed the number of authorized but unissued shares of Common Stock.

Background

Gentoo Media Inc. is the ultimate parent of the Gentoo group. The Company's existing Bonds were issued by subsidiary Gentoo Media P.L.C., with the Company and several subsidiaries as guarantor, and carry an aggregate outstanding nominal value of approximately EUR 91.5 million equivalent across a dual tranche of EUR and SEK, maturing on 18 December 2026.

The Board has, together with its advisers, evaluated refinancing alternatives ahead of the Bonds' maturity and has concluded that a combination of a new senior secured loan and a directed share issue, as described below, represents the most certain and appropriate solution for refinancing the Bonds in full and strengthening the Company's capital structure. The refinancing process has been led by an independent Refinancing Committee of the Board ("Committee"), with directors affiliated with the Lender taking no part in the Board's deliberations or resolutions on the financing. During 2026, the Company, assisted by an external financial adviser, conducted a broad market process in which more than 100 potential financing providers were approached and a number of firm financing offers were received. The Committee has also obtained an independent fairness opinion from Deloitte Malta, which concluded that the pricing and other key terms of the Loan are consistent with fair market conditions and compare favourably with the executable third-party alternatives.

The Loan

Gentoo Media PLC is the borrower under a EUR 50,000,000 senior secured Loan provided by the Lender. The Loan is senior secured, ranking at least pari passu with, and not junior to, other senior secured debt of the Group. Interest accrues at EURIBOR 3M plus 7.50% per annum, payable quarterly in cash, subject to a EURIBOR floor of 2.00%. The Loan matures on 18 December 2029 with mandatory amortisation of EUR 10,000,000 on each of the first and second anniversaries and the remaining EUR 30,000,000 due at final maturity. No arrangement or set-up fee is payable in respect of the Loan. The Company may prepay the Loan, in whole or in part, at any time without penalty or premium, and the Lender receives no equity kicker, warrants, conversion rights or other equity participation in the Company in connection with the Loan. This prepayment flexibility allows the Company to reduce debt from free cash flow at its own pace and at its own discretion.

As the Lender is a major shareholder of the Company, affiliated with Board members Mateusz Juroszek and Tomasz Juroszek, the Loan constitutes a related party transaction. The terms of the Loan were evaluated and negotiated by the independent Refinancing Committee of the Board, benchmarked against the firm offers obtained in the competitive market process described above, and are supported by an independent fairness opinion from Deloitte Malta, which concluded that the pricing and other key terms of the Loan are consistent with fair market conditions. The Board, with the board members affiliated with the Lender abstaining from the relevant deliberation and resolution related to the Loan, has concluded that the terms of the Loan are on market terms for a financing of this nature and type, having regard to the Company's financial position.

The Share Issue

The Board is seeking the necessary approvals to carry out a share issue after the Company has secured signed commitments from the Backstop Providers pursuant to which they undertake to subscribe for the total number of pro-rate shares allocated to them as well as any other shares not subscribed for by other eligible shareholders ("Backstop Shares"), ensuring that the Share Issue will be fully subscribed and deliver the target value of EUR 50,000,000. The subscription price agreed with the Backstop Providers, in respect of both their pro rata subscription rights ("Pro Rata Shares") and the Backstop Shares, is SEK 6.1633, which is equal to the volume-weighted average price of the Company's shares on Nasdaq Stockholm over the 12-month period ending on the trading day immediately preceding the date of this announcement, translated into EUR at the prevailing EUR/SEK reference exchange rate (the "Subscription Price").

The Board is planning a directed share issue of a new class of class of common stock (see further "EGM to approve Increase of Authorised Shares and Creation of New Class of Shares") targeting aggregate gross proceeds of EUR 50,000,000. The Company has secured signed commitments from the Backstop Providers (the "Underwriting Commitments") pursuant to which any new shares not subscribed for in the Share Issue by other eligible shareholders would be subscribed for by the Backstop Providers ("Backstop Shares"), to ensure the Share Issue is fully subscribed. The Underwriting Commitments are subject to customary conditions, and the subscription price for the Share Issue is SEK 6.1633, which is equal to the volume-weighted average price of the Company's shares on Nasdaq Stockholm over the 12-month period ending on 30 September 2026, (the "Subscription Price"), and constitutes a premium of approximately 58% to the closing price of the Company's shares on Nasdaq Stockholm on 30 September 2026.

The Backstop Providers are entities affiliated with the Juroszek family, which is a major shareholder of the Company; the underwriting arrangements accordingly also constitute a related party transaction, on the same basis as noted above in respect of the Loan.

The Share Issue is intended to be carried out during the fourth quarter of 2026, subject to further approvals, including the EGM approval of the increase in authorized share capital. Any decision to carry out the Share Issue and the final terms will be announced separately.

EGM to approve Increase of Authorised Shares and Creation of New Class of Shares

To enable the Share Issue, the Board intends to convene an EGM to (i) increase the number of authorised shares of the Common Stock, $0.001 par value per share, of the Company (the "Common Stock"), from 200,000,000 shares to 250,000,000 shares, and (ii) authorise an additional class of common stock, $0.001 par value per share, of the Company, to be designated "Class Z Common Stock," consisting of 100,000,000 shares. Before the Share Issue, the Company's authorised share capital is comprised of 200,000,000 shares of Common Stock, of which 134,707,974 are issued and listed. The number of shares of Class Z Common Stock in issue will at no time exceed the number of authorised but unissued shares of Common Stock. Upon the lapse of the 12-month lock-up period, holders of Class Z Common Stock may require the Company to convert their shares into Common Stock. Any such conversion, and the admission to trading of the resulting shares of Common Stock, will be subject to applicable securities-law requirements, including any prospectus required in connection with admission.

Invitation to media and analyst briefing for Ericsson Q3 2026 report

- Report to be released at approximately 7:00 AM CEST on October 15, 2026

- One live video webcast for analysts, investors and journalists at 9:00 AM CEST

STOCKHOLM, Oct. 1, 2026 /PRNewswire/ -- Ericsson's (NASDAQ: ERIC) financial report for the third quarter 2026 will be published at approximately 7:00 AM CEST on October 15, 2026. The company will issue a press release with the complete financial report attached, including tables, in PDF format. Following publication of the press release, the financial report will be available on Ericsson's website: https://www.ericsson.com/en/investors

President and CEO Per Narvinger and CFO Lars Sandström will comment on the report and take questions at a live video webcast at 9:00 AM CEST (8:00 AM BST London, 3:00 AM EDT New York).

Join the webcast or please go to www.ericsson.com/investors

To ask a question: Access dial-in information here

The webcast will be available on-demand after the event and can be viewed on our website.

NOTES TO EDITORS:

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MORE INFORMATION AT:

Ericsson Newsroom

[email protected]  (+46 10 719 69 92)

[email protected]  (+46 10 719 00 00)

ABOUT ERICSSON:

Ericsson's high-performing, programmable networks provide connectivity for billions of people every day. For 150 years, we've been pioneers in creating technology for communication. We offer mobile communication and connectivity solutions for service providers and enterprises. Together with our customers and partners, we make the digital world of tomorrow a reality. www.ericsson.com

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SANTA MONICA, Calif., Sept. 30, 2026 /PRNewswire/ -- STARZ issued the following statement regarding the status of its negotiations with Verizon and the loss of all STARZ channels, STARZ On Demand and the STARZ app through Verizon Fios.

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