By Editor , 25 October 2026
Hormuz Closure Threatens Chip Output via Helium, Bromine Shortages

Middle East – October 24, 2026 -- Spot helium prices have doubled after Iranian strikes hit Qatar's Ras Laffan Industrial City, exposing semiconductor fabs to a materials shortage that extends well beyond oil.

Qatar produced roughly one-third of the world's helium as a byproduct of LNG processing. QatarEnergy has declared force majeure, and repairs are estimated at three to five years.

By Editor , 25 October 2026
CIOs Press Ahead on AI Despite Security and Governance Fears

Orlando – October 24, 2026 -- Enterprise AI adoption is continuing in 2026 despite mounting security, accountability and control concerns, CIOs attending Gartner's IT Symposium/Xpo told CIO Dive. In financial services, three-quarters of leaders reported using the technology this year, up from less than one-third in 2024.

By Editor , 24 October 2026
KMS Lighthouse Tops 15-Tool Ranking of AI Sales Knowledge Systems

Global – October 23, 2026 -- KMS Lighthouse leads a 15-vendor ranking of AI-powered sales knowledge management systems (KMS), rated the best all-in-one option for sales teams losing deals to knowledge gaps.

Six recurring problems are slowing sales teams

The ranking cites six common failures: institutional knowledge that is never captured, data silos between departments, call volumes managers cannot track or grade, reps distracted by information searches, documentation-heavy bureaucracy, and slow onboarding that requires extended oversight of new hires.

By Editor , 23 October 2026
Five Rivals Target Oracle Guided Learning in Mixed-Stack Enterprises

Global – October 23, 2026 -- A new vendor comparison guide names five alternatives to Oracle Guided Learning (OGL) for enterprises running digital adoption programs across mixed application stacks: Whatfix, WalkMe, Userlane, Apty and Pendo. The guide scores them against six criteria, including simulation training before go-live and analytics tied to workflow outcomes.

By Editor , 23 October 2026

Global – October 22, 2026 -- SAP has stopped supporting updates to SAP Enable Now and is migrating customers to WalkMe, its recent acquisition. Organizations with learning programs on the legacy platform must now pick a replacement path.

Guide ranks six alternatives to SAP Enable Now

The vendor guide compares Whatfix, WalkMe, Assima, datango, Pendo and Userpilot. Datango is described as a migration-oriented option for legacy SAP Enable Now content. Pendo and Userpilot target customer-facing products, not SAP-centered employee enablement.

By Editor , 22 October 2026
KMS Lighthouse Tops 2026 Ranking of Eight Web-Based KMS Platforms

Global – October 21, 2026 -- KMS Lighthouse leads a 2026 ranking of eight web-based knowledge management systems (KMS), ahead of ProProfs, KnowMax, Zendesk, Confluence, Heroic, Document360 and Helpjuice. The buyer's guide names security and data-handling compliance as the decisive selection criteria.

By Editor , 21 October 2026
Missing Receipt Records Cost Cold Chain as Much as Excursions

Global – – October 20, 2026 -- A shipment that stays within temperature specification but arrives without a receipt-level record triggers the same escalation, investigation and replacement workflow as a confirmed excursion, according to cold chain assurance analysis aimed at life sciences and pharmaceutical distributors.

By Editor , 21 October 2026

Global – October 20, 2026 -- Buying Microsoft licenses directly from Microsoft can cost more than purchasing them through a Microsoft Cloud Solution Provider (CSP), because the company's partner network gives qualified resellers room to price competitively.

By Editor , 21 October 2026
UAE's Reported OPEC+ Exit Sparks Debate Over Cartel's Future

UAE – October 20, 2026 -- The United Arab Emirates' reported exit from the OPEC+ alliance has opened a debate in global oil markets over whether the cartel can hold together, with analysts split on the consequences for prices and for major importers such as India.

By Editor , 19 October 2026
3D TSV, 2.5D Packaging Market to Reach $21.5B by 2035 on AI Demand

London – October 19, 2026 -- The global 3D through-silicon-via (TSV) and 2.5D packaging market will grow from USD 9.46 billion in 2025 to USD 21.50 billion by 2035, according to Credence Research. That implies a compound annual growth rate of 8.50% for 2026-2035. The figures are the firm's proprietary model estimates, not audited supplier sales totals.