New York – October 24, 2026 -- GlobalFoundries (GF) has committed $16 billion to expand manufacturing and advanced packaging in New York and Vermont, and has designated its Vermont site as the core hub for gallium nitride (GaN) technology development. The June 4, 2025 announcement is backed by Apple, SpaceX, AMD, Qualcomm, NXP and General Motors.

Middle East – October 24, 2026 -- Spot helium prices have doubled after Iranian strikes hit Qatar's Ras Laffan Industrial City, exposing semiconductor fabs to a materials shortage that extends well beyond oil.

Qatar produced roughly one-third of the world's helium as a byproduct of LNG processing. QatarEnergy has declared force majeure, and repairs are estimated at three to five years.

Hsinchu – September 24, 2026 -- M31 Technology and Ambiq have jointly developed a Foundation IP solution on TSMC's N12e process that cuts leakage power by approximately 50% for always-on edge AI and AIoT chips, the companies announced at the TSMC 2026 North America Open Innovation Platform Ecosystem Forum.

Sunnyvale, Calif. – September 23, 2026 -- Synopsys (Nasdaq: SNPS) has certified its EDA flows on TSMC's A14 process node and expanded a multi-die design collaboration covering agentic AI workflows, integrated voltage regulators on CoWoS® packaging, and co-packaged optics support for TSMC's COUPETM technology.

San Jose, Calif. – September 17, 2026 -- GS Microelectronics U.S., Inc. (GSME) has officially joined TSMC's Open Innovation Platform (OIP) Value Chain Alliance (VCA) as a North American member partner, expanding its role in delivering full-lifecycle ASIC services from IP development through advanced packaging and testing.

Rockville, Md. and Seoul, South Korea – September 13, 2026 -- Ceva, Inc. (NASDAQ: CEVA) and LG Electronics have secured a major U.S. semiconductor company as a customer for a jointly developed Ultra-Wideband (UWB) solution, marking commercial validation for the two-company collaboration announced today.