Fort Washington – October 13, 2026 -- Kulicke & Soffa Industries (NASDAQ: KLIC) has been named the recipient of the 2026 SEMI Award for North America for its fluxless thermocompression bonding (FTC) technology, which enables interconnect pitches below 10 microns.

The award is presented during the CEO Summit Keynotes at SEMICON West. SEMI describes it as one of the semiconductor industry's highest honors for technical and commercial contributions to manufacturing.

San Francisco – October 13, 2026 -- Global 300mm front-end fab equipment spending will reach $149 billion in 2026, up 31% year-over-year, and climb to $227 billion by 2029, according to the latest SEMI 300mm Fab Outlook. SEMI projects investment will keep growing at double-digit rates through the forecast period.

Garching, Germany – October 06, 2026 -- SUSS MicroTec SE has launched its first wafer-level cleaning system, the GT200, marking the company's entry into a wafer-cleaning market it values at approximately €5.4 billion, according to research from SUSS and Yole.

Windsor, Calif. – September 12, 2026 -- Stäubli will present electrical and fluid connectivity solutions for semiconductor tool manufacturers at Semicon West in San Francisco this October, as chipmakers push suppliers to cut equipment qualification times and boost tool uptime.