Burlington – October 24, 2026 -- GlobalFoundries (GF) has qualified RFGaN1, its first RF GaN-on-silicon technology for volume production on 200mm wafers. It has also qualified SLATE, a wafer-bonding technology that cuts RF die area by up to 45% with no loss in RF performance.

Oulu – October 23, 2026 -- Aspocomp assigns every printed circuit board (PCB) customer a dedicated contact person, handled by a customer service team based at the company's Oulu factory.

Single contact handles each order from quotation to shipment

The team receives requests for quotation (RFQs), prepares offers, processes orders and tracks them until the boards ship. "From the customer's perspective, we are often the main contact point," said Maria Pasanen of the customer service team.

Oulu – October 23, 2026 -- Aspocomp has appointed Dominic Büch, a PCB industry professional with 14 years of experience, as Sales Manager for Central Europe, with a focus on defence and semiconductor customers.

Büch moves from product management to key account sales

Büch previously worked as Product Manager for HDI and wire bonding. He later became Key Account Manager for global electronics manufacturers. At Aspocomp he is responsible for technical sales and customer relationships across Central Europe.

Finland – October 23, 2026 -- Aspocomp has invested in two new 6-spindle drilling machines to expand its drilling capacity and technology capabilities for high-reliability printed circuit boards (PCBs). The company describes the units as best-in-class equipment currently available on the market.

Drilling creates the electrical interconnections between PCB layers. Aspocomp says the accuracy, stability and consistency of this step directly affect signal integrity, reliability and overall product performance.

Global – October 22, 2026 -- GF has laid out a cloud-to-edge portfolio of essential chips for AI, spanning silicon photonics, power delivery, advanced packaging, RF, embedded memory and low-power compute, in a talk at CEA-LETI.

The company ties the portfolio to AI use cases in autonomous driving, healthcare, robotics and industrial automation.

BILLERICA – October 21, 2026 -- E Ink and FUJIFILM Imaging Systems Co., Ltd. plan to start mass production of a 55-inch color ePaper signage display in March 2027, aiming to replace printed posters in Japan's railway industry.

Migdal Ha'Emek – October 21, 2026 -- Camtek Ltd. (Nasdaq: CAMT; TASE: CAMT) will publish its third quarter 2026 results on Wednesday, November 4, 2026, the semiconductor inspection and metrology equipment maker announced.

Munich – October 21, 2026 -- SINBON Electronics will exhibit at two German trade fairs in November 2026, electronica in Munich (November 10-13) and SPS Smart Production Solutions in Nuremberg (November 24-26), to present customized interconnect and system integration solutions for energy, mobility, automation and AI infrastructure.

Tokyo – October 20, 2026 -- A four-company consortium led by NTT Innovative Devices has been selected for a NEDO-backed project to build mass-production technologies for optical chiplets, with a target of more than a tenfold gain in manufacturing productivity over current R&D-stage processes.

London – October 19, 2026 -- The global 3D through-silicon-via (TSV) and 2.5D packaging market will grow from USD 9.46 billion in 2025 to USD 21.50 billion by 2035, according to Credence Research. That implies a compound annual growth rate of 8.50% for 2026-2035. The figures are the firm's proprietary model estimates, not audited supplier sales totals.