By Editor , 12 September 2026
Stäubli to Showcase Semiconductor Connectivity Tech at Semicon West

Windsor, Calif. – September 12, 2026 -- Stäubli will present electrical and fluid connectivity solutions for semiconductor tool manufacturers at Semicon West in San Francisco this October, as chipmakers push suppliers to cut equipment qualification times and boost tool uptime.

By Editor , 12 September 2026
TMC Tongxin Micro Unveils Payment, ID Chips at Seamless Africa 2026

Johannesburg – September 11, 2026 -- Tongxin Microelectronics (TMC TONGXIN MICRO) has shipped over 27 billion chips globally and secured the digital identities of more than 1 billion citizens worldwide, the company disclosed at Seamless Africa 2026, held September 8-9.

By Editor , 12 September 2026
BOE Holds First Overseas Partner Conference at IFA Berlin

Berlin – September 11, 2026 -- BOE Technology opened its first overseas Innovation Partner Conference (IPC) in Berlin on September 7, 2026, running alongside the IFA 2026 electronics show, with more than 200 global display and IoT partners invited to attend.

By Editor , 12 September 2026
BOE Holds First Overseas Innovation Conference in Berlin Alongside IFA 2026

Berlin – September 11, 2026 -- BOE Technology Group opened its first international Innovation Partner Conference (IPC) outside China on September 7, 2026, in Berlin, drawing more than 200 partners to coincide with IFA 2026 under the theme "Innovation, Globalization, Collaboration."

By Editor , 12 September 2026
SuperCom Wins First Illinois County GPS Monitoring Contract

New York – September 11, 2026 -- SuperCom (NASDAQ: SPCB) has secured a direct county-level electronic monitoring contract in Illinois, marking the company's first deal in the state and extending its U.S. footprint to 20 new states since mid-2024.

By Editor , 12 September 2026
Spirox Launches SP7000G High-Speed TGV Crack Inspection System

Hsinchu – September 11, 2026 -- Spirox Corporation (TWSE: 3055) unveiled its SP7000G high-speed TGV crack inspection system, a tool designed to support mass production testing of glass substrates for next-generation AI and HPC packaging.

By Editor , 12 September 2026
Spirox Unveils SP7000G High-Speed Crack Inspection System for TGV

Hsinchu – September 11, 2026 -- Spirox Corporation (TWSE: 3055) has launched the SP7000G, a high-speed crack inspection system designed to support high-volume manufacturing of through-glass-via (TGV) substrates for next-generation AI and high-performance computing packaging.

By Editor , 12 September 2026
Spirox Unveils SP7000G High-Speed Crack Inspection System for TGV

Hsinchu – September 11, 2026 -- Spirox Corporation (TWSE: 3055) has launched the SP7000G, a high-speed crack inspection system for Through Glass Via (TGV) technology, capable of scanning a full 510mm x 515mm glass substrate in under 20 minutes.

By Editor , 11 September 2026
Axcelis Commits $35M to New Ion Implanter Plant in Korea

Beverly, Mass. – September 11, 2026 -- Axcelis Technologies (Nasdaq: ACLS) will invest $35 million to build a new ion implantation equipment manufacturing facility in Pyeongtaek, Gyeonggi Province, Korea, with production slated to begin in the second half of 2028.

By Editor , 11 September 2026
Innovative Eyewear Names Directed Electronics ANZ Distributor

Miami – September 11, 2026 -- Innovative Eyewear, Inc. (NASDAQ: LUCY; LUCYW) has signed an exclusive distribution agreement with Directed Electronics to bring its Lucyd and Reebok smart eyewear lines to Australia and New Zealand.