Munich – – September 15, 2026 -- Silicon Line, a brand of EverProX Technologies Munich GmbH, has launched the MSDL 20G chipset, extending MIPI D-PHY connectivity from short-range cabling to distances of tens of meters while consuming less than 100 mW per 10 Gbps link.

Berlin – September 15, 2026 -- Rokid unveiled AIUI Studio at IFA Berlin 2026, a browser-based development platform that lets users build AI agent applications for its smart glasses without writing code.

Johannesburg – September 15, 2026 -- Tongxin Microelectronics (TMC TONGXIN MICRO) unveiled its THD89 payment chip series and E450R open-architecture security chip at Seamless Africa 2026, held September 8-9 in Johannesburg, positioning the Chinese semiconductor firm deeper into Africa's digital finance and identity infrastructure market.

London – September 15, 2026 -- Tulip Licensing Ltd has launched Tulip Imaging, a patent licensing program granting implementers access to more than 125,000 patents covering digital imaging and information processing technologies contributed by Canon Inc., Sony Group Corporation, Huawei Technologies Co., Ltd., and Guangdong OPPO Mobile Telecommunications Corp., Ltd.

Venice – September 15, 2026 -- DJI convened a professional forum titled "Filmmakers and Visionaries" at the Venice Production Bridge during the 83rd Venice International Film Festival, positioning its pocket-sized Osmo Pocket 4P camera as a tool capable of matching large-scale production standards.

Frankfurt – September 14, 2026 -- Aeson Power, an Australian sodium-ion battery maker, has surpassed 100,000 units deployed across more than 30 countries with its sodium-ion starter and start-stop batteries for the automotive aftermarket. The company is showcasing this portfolio alongside newly introduced sodium-ion auxiliary battery solutions for electric and commercial vehicles at Automechanika Frankfurt 2026.

Venice – September 13, 2026 -- DJI staged a professional forum titled the "Filmmakers & Visionaries Session" at the Venice Production Bridge during the 83rd Venice International Film Festival, using the event to argue that its pocket-sized Osmo Pocket 4P camera can meet the technical standards of professional cinema.

Austin, Texas – – September 13, 2026 -- La Luce Cristallina has launched a 0.5-micrometer silicon-based quantum paraelectric strontium titanate on insulator (QP-STOI) wafer platform, giving researchers and national laboratories a new tool for building next-generation cryogenic and quantum devices.

Rockville, Md. and Seoul, South Korea – September 13, 2026 -- Ceva, Inc. (NASDAQ: CEVA) and LG Electronics have secured a major U.S. semiconductor company as a customer for a jointly developed Ultra-Wideband (UWB) solution, marking commercial validation for the two-company collaboration announced today.

Seoul – September 13, 2026 -- SK keyfoundry has signed a long-term wafer supply agreement with Elmos Semiconductor SE that guarantees production capacity through 2037, extending an 18-year partnership between the Korean 8-inch foundry and the German automotive chipmaker.

The deal, signed during a ceremony in Frankfurt am Main, shifts the two companies' collaboration from 350nm to 130nm process technology, marking the first major node transition in nearly two decades of cooperation.