Milpitas, Calif. – September 19, 2026 -- Teledyne LeCroy has released the Summit Z74 Protocol Exerciser, the industry's first standalone test tool for PCIe 7.0 technology, targeting the accelerating validation needs of AI, high-performance computing, cloud, and advanced storage systems.

Pittsburgh – September 19, 2026 -- A Lakeland, Florida-based inventor has filed a patent-pending design for ONE FACE PRIVACY, a device intended to block unauthorized viewing of computers, phones, and televisions. The submission was processed through InventHelp's Tallahassee sales office.

Hsinchu – – September 19, 2026 -- M31 Technology has entered a technology collaboration with Rambus Inc. to integrate MIPI CSI and MIPI DSI controller technologies into its silicon-proven MIPI PHY portfolio, creating a complete MIPI subsystem offering for imaging and display applications.

Hangzhou – September 18, 2026 -- Hangzhou Zhilianhui Electronic Technology Co., Ltd. has launched a direct-to-consumer website for AccuMEMS, its thermal imaging brand, giving technicians and small businesses a new sales channel that bypasses traditional distributor markups on professional-grade inspection hardware.

Kyoto – September 18, 2026 -- ROHM Co., Ltd. has developed the RS4P063BPHZG, a 100V MOSFET delivering approximately five times the Safe Operating Area (SOA) tolerance of standard equivalent-sized products under VDS=100V and PW=100 microseconds.

Sydney – September 18, 2026 -- Silicon Quantum Computing (SQC) has appointed semiconductor finance veteran John Hollister as Chief Financial Officer, effective August 17, 2026, as the Sydney-based quantum computing manufacturer scales its commercial roadmap.

Rockville, Md. – September 18, 2026 -- Ceva, Inc. (NASDAQ: CEVA) has appointed Ziv Hammer as Executive Vice President, Connectivity & Sensing, a newly created role that consolidates the company's connectivity and sensing businesses along with its CTO Office under a single leader.

San Jose, Calif. – September 17, 2026 -- GS Microelectronics U.S., Inc. (GSME) has officially joined TSMC's Open Innovation Platform (OIP) Value Chain Alliance (VCA) as a North American member partner, expanding its role in delivering full-lifecycle ASIC services from IP development through advanced packaging and testing.

Amherst, Mass. – September 16, 2026 -- Myrias Optics has won the 2026 SIVA Award for "Optical Technology Breakthrough of the Year" at the China International Optoelectronic Expo, the company announced.

Berlin – September 16, 2026 -- OneOdio wrapped a five-day showcase at IFA 2026 in Berlin, unveiling its Studio Max 2 and A70 Gen 2 professional headphones to DJs, creators and industry buyers at Hall 8.2, Booth 217.

Studio Max 2 delivers 9ms latency and 120-hour battery life for professional use

Built on OneOdio's third-generation Rapid Wireless+ technology, Studio Max 2 targets DJs and audio professionals with ultra-low 9ms latency and up to 120 hours of battery life, aimed at studio production and live performance settings.