By Editor , 15 October 2026
IBM and Siemens Team Up to Move 3D Nanostack Chips Toward Production

Albany – October 14, 2026 -- IBM and Siemens have launched a joint research program to prepare IBM's nanostack transistor architecture, which packs nearly 100 billion transistors into a space the size of a fingernail at the 7 angstrom node, for volume manufacturing.