By Editor , 19 October 2026
PUFsecurity's PUFrt Wins OCP S.A.F.E. Approval for AI Data Centers

San Jose – October 19, 2026 -- PUFsecurity, a subsidiary of eMemory Technology, has received OCP S.A.F.E. approval for its PUFrt root-of-trust IP after an independent Scope 3 security assessment, and the product is now listed on the OCP Marketplace.

The company presented PUFrt at Microsoft's Caliptra Workshop on October 12, the opening day of the sold-out 2026 OCP Global Summit. The workshop drew nearly 400 attendees. Principal Security Architect Kent Chuang spoke on moving the open-source Caliptra specification into production-ready silicon for AI data centers.

By Editor , 18 October 2026

San Jose – October 18, 2026 -- Linktel Technologies says its 1.6T Linear Pluggable Optics (LPO) 2DR4 module runs at power consumption as low as 10W. The company presented the module to data center architects at the 2026 OCP Global Summit as a way to ease power and cooling loads in AI networks.

By Editor , 16 October 2026
LITEON Shows 800 VDC Racks Scaling to 1.2MW at OCP 2026

San Jose – October 15, 2026 -- LITEON Technology (2301.tw) demonstrated 800 VDC rack power architectures scaling from 330kW to 1.2MW at the 2026 OCP Global Summit, targeting the megawatt-scale AI data centers its partner NVIDIA is building around.

By Editor , 16 October 2026
Clivet Unveils Compressor Cutting Power Use Up to 40% for AI Data Centers

San Jose – October 15, 2026 -- Midea's Clivet brand has unveiled a magnetic-bearing centrifugal compressor that cuts compressor power by up to 40% at the same cooling capacity, targeting GW-scale AI data centers, at the 2026 OCP Global Summit.

Clivet presented the compressor and a full-chain liquid cooling solution at the "GW-Scale Open AIDC" forum. Dr. Yunxiao Ding, Director of the Research Institute at Midea Building Technologies, delivered the presentation, and Clivet received the "2026 GW-Scale Open AIDC Excellent Technical Presentation Award."

By Editor , 15 October 2026
xFusion Pitches 800V HVDC and 155 kW Liquid Racks at OCP 2026

San Jose – October 14, 2026 -- xFusion is showing a 155 kW liquid-cooled rack, cold plates rated above 4,000 watts per chip and a prototype 800V high-voltage DC power supply for up to 1.2 MW at the 2026 Open Compute Project (OCP) Global Summit, which runs October 12–15 at the San Jose McEnery Convention Center (Booth A33).

By Editor , 14 October 2026
Americase Panel Targets Data Center Battery Code Conflicts at OCP

Waxahachie, Texas – October 13, 2026 -- Americase International will use a 25-minute panel at the 2026 Open Compute Project (OCP) Global Summit on Oct. 15 to address conflicting codes for shipping, installing, storing and disposing of lithium batteries in AI data centers. Operators must reconcile rules that differ by country and jurisdiction as AI drives demand for battery energy storage systems (ESS).

By Editor , 14 October 2026
MSI Unveils 21-Inch ORv3 Servers With 600W Nodes at OCP Summit

San Jose – October 13, 2026 -- MSI is expanding its 21-inch ORv3 portfolio with DC-MHS-based 2-node platforms on AMD EPYC 9006 Series processors, supporting up to 600W TDP per node, at the 2026 OCP Global Summit (Booth #A49). The systems come in 2OU air-cooled and 1OU direct liquid-cooled versions and lead a booth lineup that also includes NVIDIA MGX rack and GPU server platforms and the XpertStation WS300 desktop AI supercomputer.

By Editor , 13 October 2026
Wiwynn Debuts 6kW Cold Plate, CPO Rack and Vera Rubin Build at OCP

San Jose – October 12, 2026 -- Wiwynn unveiled a 6kW double-sided cold plate that it says cuts power delivery loss by up to 80%, alongside AI rack platforms for NVIDIA and AMD and a co-packaged optics (CPO) rack, at the 2026 OCP Global Summit in San Jose.

By Editor , 13 October 2026
Wistron, Wiwynn Ready NVIDIA Vera Rubin NVL72 Racks for OCP Summit

San Jose – October 12, 2026 -- Wistron Corporation and Wiwynn Corporation say they are among the first manufacturers ready to build NVIDIA's Vera Rubin NVL72 rack-scale platform, which unifies 72 Rubin GPUs and 36 Vera CPUs in a fully liquid-cooled design. The two companies are showing the system at the 2026 OCP Global Summit in San Jose under the theme "Create AI Beyond Limits."