San Jose – October 14, 2026 -- LITEON Technology (2301) is debuting a 2.6MW Enterprise Cooling Distribution Unit (CDU) and a full 800 VDC power stack for AI factories at the OCP Global Summit 2026, running October 12-15 in San Jose, California.

San Jose – October 13, 2026 -- Compal Electronics (TWSE: 2324) will show an eight-GPU, liquid-cooled NVIDIA Blackwell Ultra server alongside Rubin-based and Vera CPU systems at OCP Global Summit 2026. The company is pitching shorter time-to-AI to cloud service providers, enterprises and AI infrastructure operators.

San Jose – October 13, 2026 -- CyberTAN Technology has unveiled a liquid-cooled Ethernet switch platform architecture built around Marvell's 102.4 Tbps Teralynx T100 silicon, and says a live demonstration at OCP Global Summit 2026 reached a Power Usage Effectiveness (PUE) of 1.1.

San Jose – October 13, 2026 -- UfiSpace is demonstrating a live 102.4Tbps liquid-cooled switch with 64 x 1.6T OSFP ports at OCP Global Summit 2026, aiming to prove thermal feasibility for 1.6T AI fabrics as data centers move toward extreme power densities.

San Jose – October 13, 2026 -- Wiwynn, Ayar Labs and Global Unichip Corp. (GUC) are showing the first live demonstration of a compute system that integrates GUC's ASIC with Ayar Labs' TeraPHY optical engine and SuperNova light source while streaming real-time health telemetry, at OCP Global Summit 2026.

San Jose – October 12, 2026 -- Cisco and NVIDIA plan to develop an open industry specification for a 400Gb/s-per-lane pluggable optical module that is expected to deliver 4x the bandwidth density of 200Gb/s-per-lane optics. The companies announced the Ultra-Dense Small Form Factor Pluggable (USFP) at the Open Compute Project (OCP) Global Summit 2026.

Cisco also said the first systems powered by its 102.4T Silicon One G300 are shipping to customers. Its 51.2T P200-based systems are running in production at hyperscalers, including Microsoft and Alibaba.

Espelkamp – October 12, 2026 -- HARTING Technology Group has joined the NVIDIA MGX ecosystem as a power system component provider for the NVIDIA Vera Rubin NVL72 platform, supplying power whips that span the shift from 480 VAC to 800 VDC data center architecture.

San Jose, Calif. – – October 06, 2026 -- AEWIN Technologies, a unit of Qisda Group, will unveil a modular DC-MHS server lineup capable of supporting rack densities above 200kW using two-phase direct liquid cooling (2P DLC) technology from subsidiary Arivor at the OCP Global Summit 2026, running October 12–15 at Booth #D9.

San Francisco – October 05, 2026 -- The SONiC Foundation, the open source network operating system hosted under the Linux Foundation, has added Lenovo, NADDOD and Zhanwang (NEXAI) as General Members, expanding its industry base ahead of the OCP Global Summit 2026 in San Jose.

San Jose – September 29, 2026 -- Compal Electronics (TWSE: 2324) will showcase megawatt-scale power and liquid-cooling infrastructure for NVIDIA accelerated computing at OCP Global Summit 2026, positioning rack-level integration as the next bottleneck for AI data centers.