MUNICH – November 03, 2026 -- Longsys (301308.SZ/09976.HK) will unveil its first industrial-grade, wide-temperature mSSD at electronica 2026, running November 10-13 in Munich, as demand for storage built for edge AI grows in automotive and industrial applications.

SiP design removes SMT assembly and solder-joint failure risk

The mSSD is built on system-in-package (SiP) technology and integrates the controller, flash memory and passive components into a single package. That eliminates surface-mount technology (SMT) assembly, cutting material use and manufacturing process requirements. Without the solder joints of conventional PCB assembly, the design also removes the associated risk of solder-joint failures. Longsys cites water resistance, dust protection and shock resistance as the basis for its industrial-grade reliability.

Longsys targets cockpits, ADAS, industrial control and rail transit

Longsys says automotive and industrial edge AI requires high bandwidth, high endurance and reliable operation across wide temperature ranges and harsh environments. Its portfolio of automotive-grade and industrial-grade storage spans UFS, eMMC, LPDDR and SPI NAND Flash. Consumer brand Lexar will show dashcam USB drives and memory cards, plus industrial-grade SD and microSD products. The target applications are intelligent cockpits, ADAS, industrial control and rail transit.

Live demos cover AISSD, AIDIMM and HLCache UFS for on-device AI

Longsys will demonstrate AISSD, AIDIMM and HLCache UFS. The company says these products are designed to optimize data access, model loading and cache acceleration, simplifying system design and improving inference responsiveness and system stability.

The company will exhibit at Booth C2.459 in Hall C2 at Messe München.